Work Package 4: Joining and Dismantling Technologies
Lead partner: CRF
Work Package Description:
WP4 “Joining and Dismantling Technologies” is mainly focused to study and develop joining technologies for assembling/disassembling of lightweight materials that will be employed during the experimental activities of the whole project. The final aim is to enable these technologies for an efficient and reliable manufacturing process of concept prototypes that will be realized in WP6.
The experimental part will be assisted, during all the WP development, by virtual analysis activities.
An activity of joint health monitoring will be as well developed in order to set an inspection methodology during the life of vehicles.
The core of WP4 will be the study of a reversible adhesive bonding technology. This development will be realized by embedding electromagnetic susceptors within traditional adhesives matrices and activating the modified adhesives by external triggers in order to obtain the melting or degradation process of adhesives. This technology will make possible an easy and rapid reversibility for a smart recycling of the ELV and for a rapid replacing of damaged components.
Lead partner: CRF
Work Package Description:
WP4 “Joining and Dismantling Technologies” is mainly focused to study and develop joining technologies for assembling/disassembling of lightweight materials that will be employed during the experimental activities of the whole project. The final aim is to enable these technologies for an efficient and reliable manufacturing process of concept prototypes that will be realized in WP6.
The experimental part will be assisted, during all the WP development, by virtual analysis activities.
An activity of joint health monitoring will be as well developed in order to set an inspection methodology during the life of vehicles.
The core of WP4 will be the study of a reversible adhesive bonding technology. This development will be realized by embedding electromagnetic susceptors within traditional adhesives matrices and activating the modified adhesives by external triggers in order to obtain the melting or degradation process of adhesives. This technology will make possible an easy and rapid reversibility for a smart recycling of the ELV and for a rapid replacing of damaged components.
